test-example-projects/qt_projects/rt-thread-master/bsp/microchip/saml10

SAML10E16A BSP Introduction

中文

• MCU: ATSAML10E16A @32MHz, 64KB FLASH, 16KB RAM, 1.62V – 3.63V
• L10: Cortex-M23 + Hardware multiplier & divider + ultra low power(< 25 μA/MHz)
• Pin: E=32 pins, D=24pins
• Flash: 16=64KB, 15=32KB, 14=16KB(size=2^n)
• SRAM : 16KB(Flash 64KB), 8KB(Flash 32KB), 4KB(Flash 16KB)
• Datasheet: https://www.microchip.com/en-us/product/ATSAML10E16A

KEY FEATURES

Core

• 32 MHz (2.64 CoreMark/MHz and up to 31 DMIPS) Arm® Cortex®-M23 with:
• Single-cycle hardware multiplier
• Hardware divider
• Nested Vector Interrupt Controller (NVIC)
• Memory Protection Unit (MPU)
• Stack Limit Checking
• TrustZone® for ARMv8-M (optional)

Memories

• 16/32/64-KB Flash
• 4/8/16-KB SRAM
• 2-KB Data Flash Write-While-Read (WWR) section for non-volatile data storage
• 256 bytes TrustRAM with physical protection features

System

• Power-on Reset (POR) and programmable Brown-out Detection (BOD)
• 8-channel Direct Memory Access Controller (DMAC)
• 8-channel event system for Inter-peripheral Core-independent Operation
• CRC-32 generator

Clock Management

• Flexible clock distribution optimized for low power
• 32.768 kHz crystal oscillator
• 32.768 kHz ultra low-power internal RC oscillator
• 0.4 to 32 MHz crystal oscillator
• 16/12/8/4 MHz low-power internal RC oscillator
• Ultra low-power digital Frequency-Locked Loop (DFLLULP)
• 32-96 MHz fractional digital Phase-Locked Loop (FDPLL96M)
• One frequency meter
• Low-Power and Power Management
• Active, Idle, Standby with partial or full SRAM retention and off sleep modes:
• Active mode (< 25 μA/MHz)
• Idle mode (< 10 μA/MHz) with 1.5 μs wake-up time
• Standby with Full SRAM Retention (0.5 μA) with 5.3 μs wake-up time
• Off mode (< 100 nA)
• Static and dynamic power gating architecture
• Sleepwalking peripherals
• Two performance levels
• Embedded Buck/LDO regulator with on-the-fly selection

Security

• Up to four tamper pins for static and dynamic intrusion detections
• Data Flash
• Optimized for secure storage
• Address and data scrambling with user-defined key (optional)
• Rapid tamper erase on scrambling key and on one user-defined row
• Silent access for data read noise reduction
• TrustRAM
• Address and data scrambling with user-defined key
• Chip-level tamper detection on physical RAM to resist microprobing attacks
• Rapid tamper erase on scrambling key and RAM data
• Silent access for data read noise reduction
• Data remanence prevention
• Peripherals
• One True Random Generator (TRNG)
• AES-128, SHA-256, and GCM cryptography accelerators (optional)
• Secure pin multiplexing to isolate on dedicated I/O pins a secured communication with external devices from the non-secure application (optional)
• TrustZone for flexible hardware isolation of memories and peripherals (optional)
• Up to six regions for the Flash
• Up to two regions for the Data Flash
• Up to two regions for the SRAM
• Individual security attribution for each peripheral, I/O, external interrupt line, and Event System Channel
• Secure Boot with SHA-based authentication (optional)
• Up to three debug access levels
• Up to three Chip Erase commands to erase part of or the entire embedded memories
• Unique 128-bit serial number
• SAM L11 Securely Key Provisioned (KPH) (optional)
• Key Provisioning using Root of Trust flow
• Security Software Framework using Kinibi-M™ Software Development Kit (SDK)

Advanced Analog and Touch

• One 12-bit 1 Msps Analog-to-Digital Converter (ADC) with up to 10 channels
• Two Analog Comparators (AC) with window compare function
• One 10-bit 350 kSPS Digital-to-Analog Converter (DAC) with external and internal outputs
• Three Operational Amplifiers (OPAMP)
• One enhanced Peripheral Touch Controller (PTC):
• Up to 20 self-capacitance channels
• Up to 100 (10x10) mutual-capacitance channels
• Low-power, high-sensitivity, environmentally robust capacitive touch buttons, sliders, and wheels
• Hardware noise filtering and noise signal desynchronization for high conducted immunity
• Driven Shield Plus for better noise immunity and moisture tolerance
• Parallel Acquisition through Polarity control
• Supports wake-up on touch from Standby Sleep mode

Communication Interfaces

• Up to three Serial Communication Interfaces (SERCOM) that can operate as:
• USART with full-duplex and single-wire half-duplex configuration
• I2C up to 3.4 Mbit/s (High-Speed mode) on one instance and up to 1 Mbit/s (Fast-mode Plus) on the second instance
• Serial Peripheral Interface (SPI)
• ISO7816 on one instance (Available on 32-pin packages only)
• RS-485 on one instance (Available on 32-pin packages only)
• LIN Slave on one instance (Available on 32-pin packages only)
• Timers/Output Compare/Input Capture
• Three 16-bit Timers/Counters (TC), each configurable as:
• One 16-bit TC with two compare/capture channels
• One 8-bit TC with two compare/capture channels
• One 32-bit TC with two compare/capture channels, by using two TCs
• 32-bit Real-Time Counter (RTC) with clock/calendar functions
• Watchdog Timer (WDT) with Window mode
• Input/Output (I/O)
• Up to 25 programmable I/O lines
• Eight external interrupts (EIC)
• One non-maskable interrupt (NMI)
• One Configurable Custom Logic (CCL) that supports:
• Combinatorial logic functions, such as AND, NAND, OR, and NOR
• Sequential logic functions, such as Flip-Flop and Latches

Qualification

• AEC-Q100 Grade 1 (-40°C to 125°C)
• Class-B safety library, IEC 60730 (future)

Packages

• 24-pin VQFN(4*4mm/17 I/O pins)
• 32-pin VQFN(5*5mm/25 I/O pins)
• 32-pin TQFP(7*7mm/17 I/O pins)
• 32-pin WLCSP(2.79*2.79mm/25 I/O pins)

Board info

• SAM L10 XPLAINED PRO